电子在梅高美集团

产品概述

Advanced wet chemical processes, production equipment, and service

我们开发, produce and sell plating chemicals and equipment for manufacturing printed circuit boards, 包底物, 半导体, 引线框架 and connectors and are recognized as the leading innovator within the electronics plating industry.
更好的连接趋势, 更大的设备功能, 性能, 和小型化, are leading to higher complexity in our customers’ 产品, which require advanced technology solutions more than ever before.

Today we serve global manufacturers with leading horizontal equipment and wet chemical process technology in the areas of surface treatment, 金属化, 电镀, 最终完成, 以及焊盘金属化, 铜柱, RDL, TSV, 和双大马士革电镀. 我们全面的投资组合, consisting of horizontal and vertical processes, allows us to participate in various future growth areas, 比如下一代智能手机, 电动和自动驾驶汽车, 物联网, 5G, 虚拟现实, 与人工智能.

在国内各大行业

Our solutions make innovation possible in a wide spectrum of industries

来自先进的移动设备, 电脑及消费电子产品, 通过通信基础设施, automotive and aerospace to medical and industrial – our advanced technology solutions support the clever functionalities inherent in all kinds of electronics components and devices. This not only indicates the scope of our technologies but also the broad mix of 产品 we offer and industries we serve.

在全球范围内, leading manufacturers in the fields of printed circuit boards, 包底物, 半导体, 引线框架, 而连接器依赖于我们的专业知识, 产品, 服务和创新. We collaborate directly with our customers, oem和一级供应商, which gives us strategic insights into market and technology trends and future product requirements. This strengthens our ability to invest in the right direction to meet the growing demand – even faster.

智能手机

大数据基础设施

汽车电子

消费电子产品

通信基础设施

计算

移动设备解决方案

Our chemical process technologies and equipment are used to build the most complex and challenging printed circuit boards (flex-/-rigid flex, 多层, HDI采用mSAP技术), 包底物, 半导体, 引线框架, and connectors used in advanced mobile devices today.

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汽车解决方案

We pay special attention to the needs and demands of automotive manufacturers and their suppliers. Our product range offers wet chemical process technology and equipment that is used to manufacture printed circuit boards (flex-/-rigid flex, 多层, 人类发展指数), 包底物, 半导体, 引线框架, and connectors used for engine and body control units, 动力传动系, 机电一体化, 照明, 信息和娱乐, 传感器, 雷达, 相机, 和ADAS模块.

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“We operate at the core of technology and develop processes for 产品 that we encounter in day-to-day electronic items – from the most complex semiconductor pieces to high-quality, high-density interconnect printed circuit boards.”

哈拉尔德达里奥
President 电子在梅高美集团 Group

我们的技术和服务中心

Helping customers stay one step ahead in all key markets

With our global TechCenter network, customer support is always close by. Our expert teams provide first-class support and consultation for every technical requirement.

We run 11 TechCenters in the 电子产品 business unit. They are in Germany, Japan, China, Singapore, Taiwan, South Korea, India, the USA, and Brazil.

多平台® P

Our solution for next-generation packaging technologies

  • 多平台® is a new and revolutionary ECD plating tool for next-generation packaging technologies. 多平台的® P system is especially designed for Panel-Level-Packaging and capable of processing panels up to 650×610 mm.
  • Innolyte® PLP – our RDL and via-filling process offers excellent distribution and via-filling capabilities in combination with an excellent line shape
  • Innolyte® P – our high-purity 铜柱 plating process offers the best uniformity at current densities up to 20 A/dm² and no voiding in IMCs

图片库

Output